Electronics Forum | Tue May 03 20:01:24 EDT 2011 | city4497s
It a recent occurance and it happen randomly on other area. I'm using senju M705-GRN360-KV and Indium SMQ 90 Leadfree solder paste, we have been using both paste for 4~5 years. We have asked the oven supplier to perform maintenance and inspection, pr
Electronics Forum | Fri Jul 06 10:35:32 EDT 2012 | ashworth14
All i used to do was blow them with an airline to remove the excess moisture then bake them for 15/20 min at 100' in an oven and that seems to work fine, i did get the info from a 4 stage cleaning guide for the actual cleaning solution we used but it
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Thu Mar 22 20:56:50 EDT 2018 | jacobidiego
Hi experts, I have some multiple and randomly missing components after reflow. PADs are seen in AOI as if the component was never there. I have seen no evidence of the chipmounters missing any components at all while populating the board. We don't ha
Electronics Forum | Fri Aug 20 10:44:40 EDT 1999 | k.t
| | Is there process by which one can do a double sided reflow (SMT on both sides) in one pass through the oven? | | | Probably not. I have heard people talk of it but never see it done and I wouldn't recommend it. | | Good luck | | Yes, it is d
Electronics Forum | Thu May 05 08:14:45 EDT 2011 | kahrpr
Where black pad exists, it is not a common problem. When I read it is totally random I doubt that. You have defiantly something going on that is unique with the process. It is either your board manufacturer or your solder paste or your profile. It c
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Sun Dec 05 22:43:27 EST 1999 | dreamsniper
Charley, Though my reply is quite late, it might be a good info for you and i hope that this info could help or could provide you some views. Some companies practice at least 1 board gap, which means the length of the pcb you are currently loading,
