Electronics Forum: best (Page 251 of 524)

Question on 4785 component database Universal chipshooter

Electronics Forum | Fri Nov 09 14:23:12 EST 2001 | vickt

You are correct...These are proprietary codes. Your best bet is to stick to the UCT-31. Other folks have tried to create a tool of their own, but have had little success. Universal Instruments offers component library conversion tools as well as patt

Land pattern design

Electronics Forum | Tue Oct 30 19:42:44 EST 2001 | davef

Jim Blankenhorn [www.smtplus.com] has the best understanding of designing pads for real life. That�s because he designs them like he wants to design them and doesn�t negotiate with a committee of thousands for an IPC standard. Consider doing this

BGA,s Storage

Electronics Forum | Wed Nov 07 08:06:29 EST 2001 | hany_khoga

Dear All : 1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?

Plastic Glue Stencil

Electronics Forum | Thu Nov 22 10:02:42 EST 2001 | Adam

Guys Has anybody had experiences with plastic glue stencils good or bad ? I also have a couple of questions : 1. Can I use the same aperture design rules for plastic stencils as I do on my metal glue stencils ? 2. How repeatable is a plastic glue st

Xray

Electronics Forum | Sat Dec 15 10:01:59 EST 2001 | davef

USE OF XRAY Xray is not used for testing BGA. Xray is an inspection tool, similar to a microscope. Check the fine SMTnet OnBoard Forum. Gil Zwieg from Glennbrook made some good points. Additionally, search the fine SMTnet Archives, where there�s

White Flux Stains - stubborn stains

Electronics Forum | Fri Feb 01 03:03:08 EST 2002 | madreindeer

Hi, That is very common in WS pastes.It is white residue (Salt) Usually it�s not dangerous it only looking bad. I think best way would be contact your paste supplier and they should know what would take a stain off if not, change supplier. There i

BGA Via Plugging

Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa

When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.

BGA solderability / moisture

Electronics Forum | Mon Feb 11 20:07:46 EST 2002 | caldon

Stephano- There is a Chemical process to revert the contamination back to its original form. The EMPF Developed it back a few years ago in conjunction with Rockwell and some others. Please contact ACI at 610-362-1200 and ask for Dr. Greg Parks. This

0402 via in pad

Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail

Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor

Solder Paste Inspection System.

Electronics Forum | Fri Mar 01 04:42:13 EST 2002 | wbu

Hi Nightbull, here�s daybull speaking. Yes the same question for me, what kind of auditor was that ? What I do in an similar audit situation is simply pointing to, if existing, an obvious lack of performance in certain processes depending on my humb


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