Electronics Forum | Fri Jan 22 12:52:38 EST 2016 | newtfly
I agree with 3DAOI.com, in that you should be looking at Cyberoptics. They have a great product if you MUST have both of these processes in line, and if you must have 3D AOI. If you are willing to go offline, and want to get both AOI and SPI in one
Electronics Forum | Wed Feb 03 15:42:31 EST 2016 | tombstonesmt
The way I view SPI is that is simply a tool. A tool to gather data to improve printing and prevent failures down the line due to screen printer anomalies. They can all inspect paste as necessary, work in closed loop with screen printer and provide a
Electronics Forum | Sun Feb 21 09:02:38 EST 2016 | alexeis
Hi, We have developed solution, called QPlan, that is reading CAD (different formats), merging it with BOM (including check of BOM and compare exceptions), comparing with your history library of Assembleon/Philips, simulating SMT process with automa
Electronics Forum | Tue Apr 26 09:29:26 EDT 2016 | davef
I've got good news and bad news: GOOD: I love Ag2 solder it's the best, most well behaved, reliable, couldn't ask for a better general purpose solder. BAD: It's leaded. I'd be concerned about embrittlement issues when soldering to gold that was 10 t
Electronics Forum | Wed Aug 24 03:52:48 EDT 2016 | Alexei
Hi, Do you need to collect information on SMT line or after it? If you need to collect after than you can use special feeder to put labels. By the way, some SMT machines (such as ASM) is counting your panels and if you using label feeder than you ca
Electronics Forum | Fri Aug 26 19:59:02 EDT 2016 | mhanrahan
We've just purchased a CP45FV Neo to replace an ancient Panasonic line. First non-Panasonic placement equipment I've worked on, so learning as I go here. So far it's been pretty straightforward. However, we use some parts that come in QFN or LCC p
Electronics Forum | Wed Oct 12 08:34:48 EDT 2016 | assuredtech
Speaking from experience, the solder pot surface has become "wetted" so to speak, so solder will naturally wick and seek. Allow the level to go low (perhaps 1 inch plus), clean the top surface area of the solder pot as best as you can - try to remove
Electronics Forum | Sun Oct 09 22:07:51 EDT 2016 | geniepro
I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could yo
Electronics Forum | Thu Nov 10 11:48:03 EST 2016 | awhite
I recently had a similar problem on our 2000Hie, although ours was a 7-Hardware, Vision X. Turns out there was a short/break in the 3-wire harness that controls the Vision X Stepper. The difficulty came from the fact that this particular harness is
Electronics Forum | Sun Nov 06 03:09:44 EST 2016 | muzzy
Hello. Thank you for your answer. Yes, you are right. It would be best to badmark those boards. But we, as a small contract assembler, can't throw away a 1/5 of client boards just because of damaged fiducials. Using pads and other features as fiducia
