Electronics Forum | Thu Nov 30 23:12:22 EST 2000 | Cal
Reno- I also agree. Education and Introduction to SMT are issues we deal with on a daily basis. We have Three level of automated assembly equpiment that we use for prototyping, training, production, and R&D. We can set you up in our facility to run y
Electronics Forum | Fri Nov 10 10:39:43 EST 2000 | omar_verdugo
Hello Eva. I was using Fujicam 1.1 and i had a problem with the theta is in the shape library for example all the drawings are on 0 degress like a in the part data and all that work fine with the anothers machines like a cp6, but when i use a ip2 i m
Electronics Forum | Tue Nov 07 10:09:51 EST 2000 | Kevin
John, Depends on what you're cleaning (paste, adhesive, ink, etc..) and your process (do operators just dump a dirty stencil in and expect a clean one out, drying time, effect on the polyester). I could suggest a couple of name brand cleaners, but I
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira
I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko
Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t
Electronics Forum | Wed Aug 16 12:49:30 EDT 2000 | Bill Schreiber
Phil, I know it must be frustrating to try and weed through all of the hype that is put out by various stencil cleaner manufacturers. However, there is some impartial published data available. An article by Richard Clouthier (now with Photo Stenc
Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F
Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side
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