Electronics Forum: best (Page 411 of 524)

Re: In House or Out

Electronics Forum | Wed Dec 01 13:19:52 EST 1999 | Wolfgang Busko

Hi Dick, first of all I will not judge what�s the best in your case for I don�t know all details of your situation. Just my opinion: As a matter of fact the amount of THT is rapidly decreasing compared to SMT. So, to stay in assembly business it vita

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko

Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I

Re: Dull Solder

Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko

Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid

Re: Breaking scored boards, breaking components.

Electronics Forum | Tue Nov 16 10:53:25 EST 1999 | Scott Cook

Ok, help me out here guys and gals...... I have never understood the concept of scoring on mixed technology or SMT boards. It is quite obvious to me that the potential for SMT solder joint damage through the mechanical stresses of breakout are high.

Re: ESD safe handling baskets

Electronics Forum | Tue Nov 02 16:00:29 EST 1999 | John Thorup

Well...maybe. First you would have to determine what type of trays you have. Conductive, dissipative or non conductive(non static generating). Dissipative would be your best choice. In the charged body model, the sudden discharge through a conduct

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Nov 01 11:07:36 EST 1999 | William

Thank you so much Dave for all of your wonderful help. You know, all I really wanted to know was a little more about the gold porosity problem. Since I am not an expert on gold immersion, nor do I claim to be, I just wanted some information so that

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.

Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo

Re: First Article

Electronics Forum | Thu Oct 07 03:19:33 EDT 1999 | Chris May

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: 0402 part identification

Electronics Forum | Wed Oct 06 09:23:47 EDT 1999 | Wolfgang Busko

| I would like comments on how the industry handles 0402 parts, regarding identification. Since the parts are too small to be labeled, how can we accurately identify the parts and or values, either before or after assembly? | When the boards go to te

Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple

I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor


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