Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner
If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r
Electronics Forum | Tue Dec 13 02:45:49 EST 2005 | hacuong
Hi, Pls give me some guide lines on standard parameters of Wave soldering technology or intruct me where we can find it. I have some issues with quality after wave soldering machine (Speedline-electrovert)and would like to verify our profile whether
Electronics Forum | Fri Aug 02 09:02:44 EDT 2019 | solderingpro
Jchris, I'll bite: - I beleive in transparecy - yes, I am the VP of PROMATION USA (a 5 time technology award winning company with an industry recognition in providing Award Winning Customer Service). I think that speaks volumes for how we support o
Electronics Forum | Fri Sep 06 09:43:01 EDT 2002 | pmathieu
Hello friends, I am looking for some information in heatsealing technology manufacturer we use it in order to solder for example flex link to a PCB and we need to have a look to other brand , actually we use a swiss brand called COVATEC thank's fo
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Fri Feb 01 10:57:52 EST 2002 | davef
Yes, that's what people are thinking. The 217�C melting temperature that you mention requires a ~250�C reflow temperature. Generally, boards, legend ink, and components cannot take that temperature. Further, few ovens can produce that temperature
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
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