Electronics Forum | Tue Dec 14 06:41:43 EST 2004 | clampron
Good Morning Everyone, I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will process more like a column grid array where the 63/37 will
Electronics Forum | Tue Mar 24 17:14:44 EDT 2009 | bas251
In my experience, before my current employment, I have personally seen damage from the water soluable fluxes left under a BGA. In consideration, I have not seen it from an assembly process where the boards are cleaned thoughly, but I have seen it dur
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Tue Oct 19 15:16:38 EDT 1999 | Frank Stryker
The CCGA is like a BGA except that the columns are more square looking and there are many more of them. They are made of lead so they are very fragile. They are very expensive. There is a special cleaning process they have to go through once it has b
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Mon Nov 13 13:26:43 EST 2017 | rcooley4
Hi all, I'm in the market for a BGA rework machine capable of handling a wide range of PCB's, anything from little 2"X2" board up to 15"X15" back-plane boards that are 0.100" thick. I would like to find a machine that can remove BGA's & QFN's, clean
Electronics Forum | Thu Apr 03 11:17:17 EST 2003 | rdr
Well, first off now I'm just starting to believe that we are fracturing again. But here is some more input D1 ENIG? I would not have thought that they would be but as usual you are probably right. D2 Again I would have to agree about it should affe
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
