Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest
You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck
Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi
Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.
Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef
It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271
Electronics Forum | Thu Jul 06 12:06:12 EDT 2006 | pavel
Rob, do you have any tip on reliable supplier of "really flat" flexible pcb? We tried several but all with issues. Thank you. Pavel
Electronics Forum | Fri Jul 07 04:18:48 EDT 2006 | Rob
Hi Pavel, We tried 6 or 7 but they all had issues with one part or another of their process. The only consistantly good ones we experienced were the Japanese manufacturers Nitto & Fujikura - these were more expensive than the other options, but pro
Electronics Forum | Fri Nov 05 16:00:22 EST 1999 | Jeff Kennedy
Anyone have information on the ROSA Technique? It is a derivative of the SERA analysis for solder-ability on pads, (they are not italian sisters)I belive the techniques were developed by Rockwell and Motorola. thanks in advance. JKK
