Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Wed Jun 18 18:24:07 EDT 2008 | jensteele
Does anyone know of an established guideline for thickness requirements? Our smaller pads continue to receive a thicker solder deposition when we measure by the larger pads for process accessibility and vice versa for the larger pads when we measure
Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Jun 19 20:52:19 EDT 2008 | davef
Please give us more information about the source of the solder that you mention. Is it: * HASL applied by your supplier * Solder on pads after wave soldering * Solder paste after printing * Solder on pads after reflow soldering ... or what?
Electronics Forum | Fri Mar 08 09:27:43 EST 2002 | Amir
hello guys and gals: we know that BGA placement or rework are such a pain in *** oh well! but i was wonder if you can help me to figure: how many BGA do you place on board annualy? (just a bulk park idea) do you rework BGA in house? do you think
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