Electronics Forum | Tue Jun 20 22:52:10 EDT 2006 | davef
We all know those academic 'reliability studies' are very focused and only give a snapshot of real life. The real reliability studies of leadfree are starting as we scramble to meet our numbers. We have no idea about your customers' expectations ab
Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Mon Jun 08 21:08:52 EDT 1998 | Dave F
| If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a sold
Electronics Forum | Tue Jun 02 17:59:01 EDT 1998 | Dave F
| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon What methods do people use to dress pads after removing and before replacing the
Electronics Forum | Thu Apr 01 15:31:23 EST 1999 | Brian
B: Edsyn make a nice tool to Solder Dress, check out the TSX-70. It'll blow and suck at the same time! | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardo
Electronics Forum | Mon Apr 05 04:50:28 EDT 2004 | harris
Hello: What's the difference of the OSP, HASL, Ni/Au immersion and ENIG? What's the advantage and disadvantage of them, special for the BGA pad? I had seen some discussion in the forum, but they are for a long time ago. Could somesone can give me the
Electronics Forum | Tue Aug 30 22:38:54 EDT 2005 | cabs
Does any one knows where to get a plating thickness meter that can be use in the fine pitch contacts and trace in PCB application like BGA pads? If there's a hand held device at lower cost much better... Also if you can recommend companies that offer
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Sat Jun 27 20:16:20 EDT 1998 | Chris Haynes
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F SRT makes
