Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Thu Jun 04 12:05:43 EDT 1998 | Anthony
Dear Dave, I have a "possible" solution to your problem, though I have never tried it myself. If you're trying to come up with a non-abrasive technique for removing solder-keep reading. If it's a faster method you desire, do yourself a favor and hi
Electronics Forum | Fri Jan 13 11:57:51 EST 2006 | james
I am reworking some BGAs and just trying to find the easiest way to do it. Can you use tacky flux without solder on the pads to reflow? or do you have to have solder on the pads before placing the BGA to reflow? Any info is appreciated. thanks
Electronics Forum | Fri Mar 30 11:05:44 EDT 2007 | realchunks
Hi Chris, A lot of it has to do with your product, t-shooting devices and techs ability. There are ways to determine BGA are at fault. X-Ray is a good way to check for shorts. Insufficients are harder to find. Some people use a dye. They squirt
Electronics Forum | Thu Feb 24 23:11:51 EST 2011 | kemasta
HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000. But after the BGA re-ball, is work fine. Anyone have any idea to trobleshoot
Electronics Forum | Fri May 07 09:25:55 EDT 2010 | dwonch
Yes, the vias under the BGAs are the only ones capped. I tend to agree with you that the leaching should affect the bottom more than the top and that was actually the case with the two previous shops that had this problem. We suspected with those s
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
