Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Fri Dec 18 10:18:55 EST 1998 | Dave F
| I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it doe
Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22
If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
Electronics Forum | Mon Jun 27 06:52:07 EDT 2011 | rpatel28364
Hi All We are facing problem with solderability of BGA connector. After Xray we have found open under BGA connector. After removing from PCB it seems some copper pads are still gold. We are not sure why this is happening. We have 5 thou stencil and
Electronics Forum | Wed Mar 07 13:58:06 EST 2018 | griinder
We are using Gerber EZ Teach to inspect near 100% of some boards. Many component footprints seem to be assigned custom packages. These custom packages come up as "preview errors" during inspection. I have noticed when I manually move the camera to th
Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi
Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Fri Mar 22 12:57:30 EDT 2013 | bandjwet
Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
