Electronics Forum | Fri Mar 05 07:47:29 EST 2010 | kpm135
How is that going to help hold a BGA to the bottom of the board during secondary reflow?
Electronics Forum | Thu Oct 13 10:44:18 EDT 2011 | spitkis2
Have you considered adding adhesive / epoxy at the corners of the BGA to secure it in place?
Electronics Forum | Tue Feb 02 13:55:52 EST 1999 | Brian Stumm
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | Al, From my experience BGA's are no more difficult to profile than any other component.
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Wed Apr 19 07:45:50 EDT 2006 | Carol Stirling
Sorry about that. I'd like to post a picture but doubt it's possible. Baseball cap = The pad solder reflows but the BGA ball and the pad don't reflow together in a continuous elliptical shape. Carol
Electronics Forum | Mon Oct 26 19:48:14 EST 1998 | Scott B.
| | What are the key feature to look for in buying a profiling product for Reflow ? | | | | Who's is the best and how much do these systems cost ? | | | | Thanks in advance. | | | | Hi Mark, | | I am currently the oven sector engineer for a larg
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef
Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch
Electronics Forum | Wed Jan 24 11:24:07 EST 2007 | ruggi
I'm probably not telling you anything you don't already know, but a technique that's worked very well in the past for me is to methodically step through every part of the process and observe your boards being built, or take a scrap or simulated one a
Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe
I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a