Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Tue Feb 19 16:26:51 EST 2008 | edatasys
Check out http://www.solderstar.com They have 4 , 6 , 9 or 12 channel products. Software is user friendly and contains predefined specs. for solder paste & reflow ovens. Makes setup quick & easy, also has simulation tools to quickly optimize profile
Electronics Forum | Mon Feb 04 10:30:10 EST 2008 | tonyamenson
Well the profiler IS out for calibration so I can't use it. However, what piqued my curiosity is your statement concerning uneven heating. On the product we were running we had several non-liquidous solderjoints where as the rest of the joints looke
Electronics Forum | Tue Jun 03 15:18:33 EDT 2008 | jdengler
As chunks says use the paste manufacturers recommendation. Our paste manufacturer has recommendations on both �straight ramp� and �soak� for our paste. We prefer the �straight ramp� on most boards due to the increased production it enables. There a
Electronics Forum | Wed Jun 18 19:31:15 EDT 2008 | mlimberg
Woo10, If you need assistance with profiling in the vapor phase environment, I am with KIC Thermal and we have been working with vapor phase equipment manufactures developing processes and profilers for use in the vapor phase reflow applications. P
Electronics Forum | Mon Feb 02 09:22:55 EST 2009 | ck_the_flip
Everyone's telling you setpoints, but yet, we haven't seen a thermal profile from you. It'd help if you can provide this, and using everyone's recommended setpoints, determine if your profile is meeting: 1.)Time Above Liquidus 2.) Peak 3.) Ramp
Electronics Forum | Wed Feb 04 09:18:57 EST 2009 | stepheniii
You need to profile to the paste. And if a part can't take the temperatures, then you have to have something done about the parts. At one time most components had peak temperature information back when we didn't really need it becuase profiles were
Electronics Forum | Thu Feb 18 14:34:39 EST 2010 | jlawson
I have also seen on Heller ovens (even new ones EXL series) cross profile temperature differences over their spec of +/- 3 deg C, sometimes up to 7-10 deg C, 200-230mm from fixed rail. This can cause funny issues , profiling can cover this up and not
Electronics Forum | Thu Jun 19 10:31:28 EDT 2014 | emeto
Hi Edri, this is not a race here. Are you curing some kind of glue on your board? THe shortest profile I ever ran is for AIM solder paste - about 4 minutes total. with speed 8m/min your profile is going to be 45 seconds and I don't think this is the
Electronics Forum | Tue Sep 30 12:16:23 EDT 2014 | tech1
Check your pad sizes against the supplier recommendation. I have noticed that these LED packages are very light and easily move around during reflow. Human nature has us checking the profile and making changes when in fact it is usually something els
