Electronics Forum | Mon May 09 15:05:01 EDT 2016 | wooly1
We are trying to reflow some Fox brand crystals to some boards but the solder will not wick up on the ends of the component. It solders fine to the under side but not to the ends. I have tried numerous things with the reflow profile but nothing seems
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan
thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod
Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef
I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel
Electronics Forum | Thu Sep 23 10:34:54 EDT 2021 | oclsc
Hi Evtimov Thank you for a quick reply for my question :-) The reason why I am using an empty board is only to have a place for the temperture logger beside the fully mounted SMD board that is monitoring the reflow-profil and also to get the same co
Electronics Forum | Fri Jun 10 13:54:01 EDT 2022 | davef
Solder connections to the castellated and other components need improvement. Are you profiling on the problem leads? Microchip Technology Inc. RN4678 Bluetooth module reflow recommendations - http://ww1.microchip.com/downloads/en/DeviceDoc/RN4678-Bl
Electronics Forum | Fri Sep 22 08:22:17 EDT 2023 | linux
Hello All, This would be a question for someone with experience in PCB design, Intrusive reflow Narrow profile connector(Electrode Rectangular) L=1mm X W=0.9mm. What shape and size hole is required in the PCB to ensure sufficient solderability and re
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
Electronics Forum | Fri Oct 10 19:14:27 EDT 2003 | MA/NY DDave
Hi SMTAnet, SMTnet, I am pretty sure recently I heard and read a report with them simply reflowed with an improvement in strengths from a slowly degrading strength. I can't find it quick and don't remember all the caveats like maybe an underfill phe
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
