Electronics Forum | Tue Aug 09 13:44:48 EDT 2005 | mtd
The solder on the rest of the board looks good. There are no large components around these parts. We check the profile using a KIC and it met the recommendations of the solder paste manufacturer. I have not did a dip test of the board or components.
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Fri Sep 09 11:01:14 EDT 2005 | rob
If the tombstoning is thermal (occuring during reflow) then try slightly reducing the stencil apertures so there is less the paste on the pads, reducing the forces acting on the component. Also take a look at the cooldown profile & making it more
Electronics Forum | Tue Oct 11 17:27:49 EDT 2005 | artekeng
Depending on the metal and bond to FR4 you may be able to get a better profile if you use conductive heating.(vs standard convection reflow)
Electronics Forum | Tue Oct 18 12:58:02 EDT 2005 | ???
The quad's are absolutely junk but to be fair to them....the name was just slapped on them.....they are actually a zcr product.....which the first version wasnt bad but when you got to the profile ovens.....wow.....what junk they were.....they are go
Electronics Forum | Wed Nov 23 15:02:38 EST 2005 | tglenn
We are using AIM WS300 solder paste and are experiencing excessive voiding on our BGAs. We have exhausted reflow profile alternatives and just can't beat the voids. Has anyone had success with this paste on BGAs? If so how?
Electronics Forum | Wed Nov 30 21:21:57 EST 2005 | Kwon Jun Kwak
any use the ramp, soak and spike profile methode, or with lead free using the straight ramp approach? What most paste manufactures recomended?
Electronics Forum | Thu Dec 01 11:46:41 EST 2005 | pjc
FYI: Most Sn/Pb and Pb Free solderpastes today are designed to run both a ramp-soak-spike or ramp-spike profiles.
Electronics Forum | Mon Jan 09 16:47:45 EST 2006 | slthomas
Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.
Electronics Forum | Mon Jan 09 08:47:27 EST 2006 | azbvc
Hi guys.. I just want to know on what are common types of terminal plating on chip capasitor and does each plating will affect reflow profile? Thank..
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