Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0
we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick
Electronics Forum | Thu Feb 14 11:39:06 EST 2013 | pbarton
We have a couple here in the UK, one in the USA and some more in China. Profile repeatability has been excellent, whatever the loading. Reliability good also.
Electronics Forum | Thu Jan 08 11:06:40 EST 2004 | russ
If I read this correctly you have two identical ovens that were setup the same ie zone temps, fan speeds etc... when you ran the same board through each of them one showed a lower board temp. Is this correct? Is the temp of the board 7 deg. lower t
Electronics Forum | Sat Sep 27 09:32:36 EDT 2003 | mantis
All, I was wondering what causes the corners of a bga to lift during reflow process.Now just to clarify i have been running this one particular product for 4 years and i have the process and reflow profile down to a tee.But recently i have witnessed
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Tue Sep 30 20:59:40 EDT 2003 | Dean
Have you verified the thermal profile recently? I would start there and verify your process has not shifted. It does happen.
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
