Electronics Forum: bga reflow profile (Page 306 of 382)

HAVING PROBLEMS W/ PARTS MOVING AT REFLOW

Electronics Forum | Wed Apr 21 12:21:57 EDT 2004 | davef

Please help us understand your situation better. * How do �Having Problems W/ Parts Moving At Reflow� and �When the boards come out of the oven the pads look very wet from flux� relate to one another? * Tell us about solder, flux, reflow profile, and

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X

Reflow with lead-free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts

Electronics Forum | Fri Dec 20 18:48:18 EST 2019 | rhormigox

Reflow with lead free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts While I have been an observer for years, now I am mostly new into reflow process. I tried to reflow a big 4 Layers board and without knowing much about solder pastes oth

BGA Rework

Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette

Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t

Solder ball crack

Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef

First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [

Reflow help needed, Hotflow 5

Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic

First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran

Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the

Re: White Tin

Electronics Forum | Fri Apr 30 03:49:25 EDT 1999 | Charles Stringer

| | | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | | | We are considering trying boards with Whit

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon

| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord

Hey Guys, you gotta check this out!

Electronics Forum | Sun Apr 25 18:25:10 EDT 1999 | Steve Gregory

Hey Guys! Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... Whoever laid this out, I'd like to go and do a "Back to t


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