Electronics Forum: bga reflow profile (Page 311 of 382)

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 15:23:27 EST 2001 | davef

I'm with Brian. TIN COATED 0603 FAILURES Welcome to the lead-free generation. ;-) The Eurolanders are so blanking stupid, it just makes my head hurt. But then again, it doesn�t take much. OK, enough pontification. Your profile is setup incorrec

lead coalescence in solder joint

Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto

Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures

MELF component short togehter

Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew

Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component

Reflow Oven Monitoring

Electronics Forum | Wed Aug 07 08:43:32 EDT 2002 | davef

Comments on copper plate temperature monitoring are: * Some people use this type of temperature monitoring to start the day as an element of an oven capability measurement and monitoring program. * Using a copper or other metal plate, like aluminum,

0603 - stencil thickness

Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax

Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(

8 way 1606 resister arrays

Electronics Forum | Fri Mar 21 20:24:13 EST 2003 | msimkin

Has anyone had success in soldering these devices, in particular devices from a company callede Pycomp. They are 8 way 0402 sized terminations. I have experemented with the printing process, placement verification & reflow profile. Unfortuanlty, I am

Reflow oven

Electronics Forum | Thu Aug 19 12:35:27 EDT 2004 | rlackey

Hi Snehal, Here are some considerations for you: Will you be doing Lead free soldering in the near future? What level of throughput are you looking for - are you high volume, medium or low volume? What is the support network like in your area? W

lead pull out issue

Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose

recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u

lead pull out issue

Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose

Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl

Solder paste height checking

Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI

Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t


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