Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower
Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently
Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef
Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature
Electronics Forum | Thu Mar 22 17:37:06 EST 2001 | davef
Hey!!! Watch it!!! I don�t want to get you believing too much of this stuff. But if you bought that, listen to this � some circuits are so critical with that skin effect stuff that they use silver as the top level solderability preservative. Turn
Electronics Forum | Tue Feb 09 18:48:21 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook
| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately
Electronics Forum | Mon Aug 27 16:13:35 EDT 2001 | seand
Hello Everyone, For QC purposes, there are a couple of methods to both qaulitatively and quantitatively inspect your manufacturing process. For Paste inspcetion, an inline machine like the SE300 by CyberOptics may be appropriate. You may also inco
Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
Electronics Forum | Thu Jul 04 00:18:10 EDT 2002 | ianchan
Hi mate, in humble opinion, Hot air Convection types are here to stay. Some machine designer folks are combining IR and Hot Air Relow into integrated technological units for commercial sale to folks like us. Dave F tells us that another group of d