Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Fri Aug 02 12:01:40 EDT 2002 | johnw
interesting, not at all what we were told so yes lot's of contradictions comming from them, I have to say personally I've not beein impressed with there technical service of late, are they getting complacent I ask? it's strange they say it'll cause
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
Electronics Forum | Thu Nov 14 00:06:23 EST 2002 | iman
note: retyped due to some earlier technical fault. does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfal
Electronics Forum | Tue Sep 14 19:47:16 EDT 2004 | davef
use something other than HASL. "The rest of the world seems to be processing with no problems..." [Hello!!! Earth to Carol. This is a test.] Things you are considering could be more trouble than they�re worth. "1) Reduce via hole size" [If you re
Electronics Forum | Tue Mar 24 20:25:18 EDT 2009 | davef
It is very common to use low residue flux with low-standoff parts. On the other hand, sure you can clean under low-standoff parts. We've talked about this previously. Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Tue Apr 05 16:20:49 EDT 2011 | cvoyles
I work with a small EMS shop that has extremely good capability because I created it for an R&D Lab for the U.S. Army. We have at times discussed leasing the equipment/facility to other companies who prefer that to farming out their work to an EMS.
Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman
Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J
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