Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Thu Jan 14 08:34:18 EST 2016 | cyber_wolf
His suggestion is that you come into the 21st century and buy a data logger rather than feeding wires through the entire reflow oven. That is old school and it is very cumbersome as you undoubtedly know. If you are in a position where a logger is no
Electronics Forum | Thu Apr 27 11:50:21 EDT 2006 | samir
90% of the battle with thermal profiling is your thermocouple attachment. That is Process Engineering 101. It's just like painting your house. The masking and prep work will make or break the end result. KIC did a DoE on which thermocouple attach
Electronics Forum | Tue Sep 11 08:36:53 EDT 2007 | cyber_wolf
We seem to have a lot of blowers going bad on our Omni 10 lately. We run PB free and/or elevated sn/pb profiles on a regular basis. I am starting to suspect that the elevated zone temps are causing the blowers to fail. Has anyone else had this prob
Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Wed Jul 26 12:39:00 EDT 2006 | spari77
we encounter some open joint on the CPU socket after rework. We tried to reflow the boards again (using BGA rework machine) and found that the contact issue was resolved. Is there any risk to perform a reflow again on the CPU Socket boards without re
Electronics Forum | Tue Jan 30 02:29:16 EST 2001 | arul2000
Dave, To do further analysis we don't have the BGAs of the batch from which we had this issue. We don't face this issue now in the current production lots. The problem got solved while trying to find the root cause. Will keep updated if it occurs ag
Electronics Forum | Thu Mar 04 07:57:32 EST 1999 | John Godfrey
I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in atmospe
Electronics Forum | Wed May 04 15:01:23 EDT 2005 | Dr. Klein
Thanks siverts, The problem with open the sealed MSD bags before the production, is from the rezone that we don�t know exactly when the production start. If we will open the bags before production there is a possibility that the component will be ou
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