Electronics Forum | Mon Mar 29 11:22:43 EDT 2010 | krish_bala
Thank you Graham and Steve, I realized I was running a bit too hot and that is easy for me to change. The problem however was that I have 14 other profiles that I had created that still give me varied results. I am still facing issues with each di
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
Electronics Forum | Thu Oct 20 09:58:54 EDT 2016 | davef
You say, "... re-flow profile temperature, the peak temperature of a component was on 253*C." Questions are: * I assume that was the temperature of the component body. What was the temperature of the solder ball? * How does the temperature on the pr
Electronics Forum | Thu Jan 19 11:10:13 EST 2017 | rgduval
I'd start by checking the manufacturers documentation, and seeing if they have any application notes regarding reflow recommendations for the part. But, in general, make sure to bake the parts prior to assembly, they are notoriously moisture-sensiti
Electronics Forum | Thu Aug 25 09:56:08 EDT 2005 | james
I ran a profile on a dummy board with no parts and the peak temp is 220. The 220 is just the temperature of the board of course. With that BGA on it, I am pretty sure it sucks up alot of the heat. Also I am looking at the profile and notice that i
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
