Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL
Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Tue Sep 15 09:04:57 EDT 1998 | Chrys
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Mon Sep 29 02:35:28 EDT 2003 | Sam
Hi Mantis. Has there been any changes in the BGA itself? One of our BGAs changed to a newer type, and after that we had problems with corner lifting. In that case problem was BGA's structure, there was mismatch in TCE between BGA's substrate and mo
Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator
If only my company would pay for a membership to IPC......
Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator
Very informative article. Thanks Dave.
Electronics Forum | Sat Sep 27 09:32:36 EDT 2003 | mantis
All, I was wondering what causes the corners of a bga to lift during reflow process.Now just to clarify i have been running this one particular product for 4 years and i have the process and reflow profile down to a tee.But recently i have witnessed
Electronics Forum | Mon Jun 21 08:01:38 EDT 2010 | jm
Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's
Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
