Electronics Forum | Wed Feb 24 13:05:04 EST 1999 | Mike Larsen
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Wed Jul 03 20:18:50 EDT 2002 | Dreamsniper
Vapor Phase, Nitrogen Oven, Convective Oven? Which among the above 3 ovens do I need to process my BGA's and Fine pitch on a 6 to 12 layer board. Which will give me best results? Inert type oven or just a convective oven? Another thing is what will
Electronics Forum | Mon Oct 14 09:31:46 EDT 2002 | russ
First off, are you planning on placing these parts with your placement machine since you mentioned that you do not have an alignment system for rework? I would be leery of handplacing a BGA into paste by steady hand and craned neck alignment. Seco
Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf
I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Sat Aug 22 05:19:42 EDT 2009 | ghepo
Dear Eric, in my opinion this is a very complex problem, that require to know many details for answer. For example : 1) what about the PCB finishing ? Have you verify the quality of they ? 2) what about the solder paste (the exactly composition)? 3)
Electronics Forum | Fri Feb 05 14:39:50 EST 2010 | gregcr
Hi All, We evaluated and approved KESTER R520A for our default RoHS solder paste a couple years back. It's time to re-evaluate to see if this material is still the best choice. Please let me know your opinion on the solder paste you are using, and
Electronics Forum | Wed Jul 03 14:16:09 EDT 2013 | horchak
Hi, I had seen your post earlier but had lost my very old log on information. First I will say that BGAs should never be placed and re-flowed with a rework station unless there is absolutely no other option, so I don't understand why your assembly ho
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