Electronics Forum | Fri May 22 01:34:23 EDT 2009 | isd_jwendell
I have used the Fluke 53 (single channel) and 54 (2 channel) hand-held units. You can get the model 54 for about $300 if you shop around. Is this too much?
Electronics Forum | Tue Sep 22 10:31:01 EDT 2009 | patrickbruneel
Dave, now there’s a new failure “the yellow light of dead” http://www.bbc.co.uk/blogs/watchdog/2009/09/playstation3_and_the_yellow_li.html No further comments lol
Electronics Forum | Fri Jan 07 10:35:36 EST 2011 | davef
Tell your customer that you need five extra assemblies so that you can do a good job of designing process to ensure that they don't receive poo boards.
Electronics Forum | Wed Jan 12 03:39:00 EST 2011 | rpatel28364
Do you think it is because of too much solder. we have 5thou stencil and no reduction in aperture. Please reply
Electronics Forum | Wed Jun 08 20:21:42 EDT 2011 | kahrpr
I agree that it looks like to much solder paste. Thats a lot of bridging in one area. It had to get the solder from some ware.
Electronics Forum | Thu Jun 09 13:38:16 EDT 2011 | rdubya
You might want to check the components as well, I've seen a similar problem with re-balled parts using the wrong diameter ball. that would also contribute to added solder. good luck
Electronics Forum | Wed May 25 15:40:27 EDT 2005 | james
Has anyone had good luck with the reflow on these extremely heavy bga's. This bga has 1517 balls and requires alot of heat because of the thickness of the part. Just wondering if anyone out there can help me.
Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks
Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
