Electronics Forum | Mon Jun 03 22:16:49 EDT 2002 | alex_kirichenko
Hi Jim! Just an idea.... There are some reflow ovens which use cooling on the bottom side of pcb during reflow for doublesided boards. It prevents solder on the bottom side to melt. You might try cooling your BGA while reflowing parts on opposit s
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Mon Nov 01 07:39:49 EST 2004 | Bob R.
Yes, you can place a BGA in flux and get good reflow. However, depending on BGA type and size you should expect a yield loss due to coplanarity issues. Having the paste on the pad definately helps your yield.
Electronics Forum | Fri Feb 23 15:31:31 EST 2007 | realchunks
Running the BGA first is OK. We run double sided BGA baords all the time without problem.
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Thu Mar 02 21:51:46 EST 2000 | Dave F
Robert: Consider requesting samples of different sized solder balls from a variety of suppliers, solder them to dummy boards, and compare the size of reflowed balls to your spec. Then you could buy based on results. My2� Dave F
Electronics Forum | Thu Mar 02 21:51:46 EST 2000 | Dave F
Robert: Consider requesting samples of different sized solder balls from a variety of suppliers, solder them to dummy boards, and compare the size of reflowed balls to your spec. Then you could buy based on results. My2� Dave F
Electronics Forum | Fri Jul 31 21:51:09 EDT 2009 | quirmche
Cool I'll check that, thanks! How about maybe video training on rework/reflow?
Electronics Forum | Thu Jan 27 04:02:00 EST 2011 | richiereilly1
Hi, We had a similar issue to this. When we examined the boards at x-ray there were no apparent defects, We sent the boards for Dye and pry testing and we found that there were crack or gaps between the paste on the PCB and the BGA ball. basically th
Electronics Forum | Tue Sep 14 13:37:51 EDT 2010 | dan_ems
Hi Gany, did you check the temperature at reflow profile on this BGA ?
