Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis
Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the
Electronics Forum | Thu Jan 16 10:07:12 EST 2020 | davef
Hej back at ya Your connectors could be warping during reflow. Find out by putting a connector on a hot plate and increasing the temperature. If so, you might get away with a simple fix of rotating the board 90* on your reflow oven conveyor. If you
Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee
| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Mon Apr 10 22:17:34 EDT 2000 | Dave F
Rob: What was driving the uBGA bridging? On your arrays: * I doubt that your supplier would be pleased that you are wave soldering these pups. If you insist, present leads to the wave on opposite sides of the package at the same time. Is this an
Electronics Forum | Mon Jun 18 19:22:38 EDT 2001 | Gil Zweig
Dave; See my answer to "Alternate to X-ray" The combination of endoscope optical inspection with x-ray inspection provides the most effective means of BGA inspection. Transmission x-ray provides a very rapid means of qualifying then process control o
Electronics Forum | Tue Jul 24 13:26:10 EDT 2001 | gdstanton
Steve, I was aware of the rework requirement but was looking more towards the reflow profile. I wanted to know if there was any significant benefit other than rework itself. I suspected there isn't but I just wanted to be sure. Bye the way--did y
Electronics Forum | Tue Jul 24 14:00:08 EDT 2001 | Steve Schrader
Greg, Yes, I did my tour of duty. Is your boss back from Bermuda yet? If so, tell her to check her email! Thanks. BTW, there could be a benefit to moving parts, but that would be dictated by your ability/inability to achieve a proper reflow prof
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Mon Dec 13 15:56:16 EST 1999 | David Spilker
In our DFM guidelines for PWB layout we have discouraged placing BGAs in the longitudinal center of a PWB. We believed the increase stress through reflow and wave was not good for BGAs - probably read it or reasoned it. Now, this position is being
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