Electronics Forum | Fri Feb 09 10:00:12 EST 2007 | patrickbruneel
Interesting BGA saga http://www.emsnow.com/npps/story.cfm?ID=24434 To be continued Patrick
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Mon Mar 19 06:05:16 EDT 2007 | chrissieneale
Hello - what's coming up as the top reason for BGA rework? Are there more handeling issues than actual problems with SMT placement / rework? Sorry it's a really general question, but i'm after some really general answers. :) Chrissie
Electronics Forum | Thu Mar 29 09:03:53 EDT 2007 | RA
Dear All, We need to buy an BGA Rework station at an medium scale budget, can anybody provide ur best suggestion,(best make and model )
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Fri Mar 30 05:06:32 EDT 2007 | aram
Dear ALL , i wish to know about the suitale BGA rework station for the large volume production-pls share ur best knowlede.
Electronics Forum | Mon Apr 16 01:26:07 EDT 2007 | CH
Dear Sir, Thanks for your reply. From your mail, we could understnd that you are happy with Hot air rework system. Can you please advise the make and model- you are using for BGA repair . Also please advise the PACE MODEL YOU ARE REFERRING TO so t
Electronics Forum | Mon Apr 16 01:32:20 EDT 2007 | RAS
Dear Bart, Will u pls advice us,what are best parameters that u like from the PACE REWORK STATION and how it should better from other make of BGA rework station. Kindly Clarify with ur best suggestion. Regards, RAS.
Electronics Forum | Mon Apr 16 20:53:56 EDT 2007 | davef
Tell us about: * Temperatures and times of the thermal profile * Where the thermocouples were mounted * Materials involved * Where in the process the 672 BGA component is soldered * Processes that follow that soldering
Electronics Forum | Wed May 02 12:12:23 EDT 2007 | SWAG
Restrictive carriers or lack of carrier in reflow can cause board warpage = bad for BGA's. Might be something to look at.
