Electronics Forum | Wed Sep 09 11:17:09 EDT 2009 | clampron
Hello Radek, Does a new (unbaked) BGA exhibit the same crack? If so, adress this with the manufacturer. If not, what are your baking parameters? Chris
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Sat Sep 12 14:10:38 EDT 2009 | GSx
First, make sure that 63/37 BGA can withstand higher reflow temperature of of lead free SAC305 GSx
Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef
What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?
Electronics Forum | Thu Nov 05 12:35:01 EST 2009 | martinphill
Davef, We have BGA (removed from PCBA). We have Cleaned up the pads. Instead of reballing can we directly mount on the Prime PCB like QFN. Thanks Martin
Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham
I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed
Electronics Forum | Thu Nov 19 22:52:34 EST 2009 | davef
Something is incorrect. Either: * Assembly dead functional and when we press BGA by thumb it works ... OR * Cross section with no voids , no solder joint crack. Turn-off the smoke machine.
Electronics Forum | Sat Nov 21 02:04:47 EST 2009 | Sean
Hi Patrick, Sorry, it should be Intel's Southbridge BGA instead of Intel's Northbridge BGA.. Thanks, Sean
Electronics Forum | Mon Dec 07 13:32:53 EST 2009 | ceiaen
Have you considered outsourcing the rework of the BGA? Besides the rework system, you will need: solder paste, stencils, cleaning method, X-ray, and the biggest part experience...
