Electronics Forum | Wed Apr 30 03:44:45 EDT 2003 | chrissieneale
Lwei, Our boards are double sided and have BGA's on one side. We always run this side first so we can x-ray inspect the BGA's for short circuits, then run the second side. Depending on what industry you are in you may have some problems.. we work in
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Wed Apr 28 16:07:32 EDT 2004 | davef
In rework, your thermal recipe needs to better mimic the recipe that your use in your reflow oven. Oh, that and proper preheating of the board and BGA. [Yano, if you get bored fighting this, rereflowing the board is within reason.] That you are hi
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Sun Nov 20 22:35:26 EST 2005 | pyramus
Hi guys!! Just want to ask regarding the Bluetooth Module. The module has BGA inside shield before production we checked Raw materials no short probems. But after Passing N2 Reflow during normal production the BGA inside module tend to get shorted..
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Thu May 08 15:51:06 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FCBGA memory chip (to be replaced) and an exposed-die FCBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with t
