Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
Electronics Forum | Mon Jun 24 19:15:13 EDT 2002 | Chris C
Do I really need a Vapour Phase Oven or a Nitrogen Oven when soldering PBGA's if my PCB has only 2 to 3 BGA's (ball pitch of 0.5mm to 1.27mm) ? Is the quality of soldering when using an 8-Zone Convective Oven is not acceptable? I have been bombarded
Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail
Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou
Electronics Forum | Tue Oct 29 15:55:16 EST 2002 | babe
If you are using a low end hot air system IE: Weller, Hakko or Pace then your problems are with the system and not necessarily with your process. However process is important. We have found by inspection with an Ersa Scope (BGA inspection system) tha
Electronics Forum | Mon Apr 28 04:07:09 EDT 2003 | chrissieneale
The BGA rework process has been qualified for space flight. Which basically means someone sensible over in ESA has been replacing BGA's and life testing them. I agree the best way is to build clean boards without any mistakes, but i can honestly say
Electronics Forum | Thu Jun 19 10:47:29 EDT 2003 | Eric QE
Caltex or Ersa type system is good, Caltex prisms, necessary for looking underneath the BGA can be crashed easily when looking under low profile or Micros. $40-$110 each depending on the availability and who makes 'em. We have 2D and 3D X-ray avai
Electronics Forum | Thu Jun 12 00:32:23 EDT 2003 | Henry
I would like to ask a question about SMT reflow process. I did 10 pcs samples but all is fail. The sample is double faces to have components (up-side has 4 pcs of BGA and down-side has 3 BGA and 2 QFP). And I saw some of BGA which is tilting in the P
Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
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