Electronics Forum | Fri Jun 16 18:48:57 EDT 2006 | GS
Hi Grant, just my opinion, I think the concern could be related to the extra temperature the BGAs have been exposed during the Lead Free Reflow Temperature. So you need to check ( data sheet) what is the max temperature and how long the Pb/BGA can w
Electronics Forum | Mon Jun 19 04:42:37 EDT 2006 | Loco
There are plenty of studies on this subject. If the BGA can handle the extra temperature and they are soldered on a leadfree profile, the general result seems to be a better reliability than Pb :) Just out of the top of my head, there was a link to
Electronics Forum | Thu Jun 29 08:41:24 EDT 2006 | russ
I agree that a BGA may be the better/easier process overall, but it is not 3 dollars per assy better, I am in agreement that you should be able to handle QFPS just as well as a BGA. PBfree BGAs do not self align BTW, so one needs to keep that in mi
Electronics Forum | Wed Aug 30 23:45:23 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 30 23:45:40 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Tue Dec 05 16:08:41 EST 2006 | dphilbrick
I would suspect if you had a full evaluation done there would be the same issue with Nickel oxidation everywhere. The reason BGA's fall off (or have solder connection issues first) is due to their size. A slight flex in the board has a much larger im
Electronics Forum | Wed Jan 03 10:41:47 EST 2007 | Rob
Consider this: The inner balls will be at a lower temperture than the outer balls in reflow, so if you cannot inpsect them then that may be where your problem lies. Are you reworking with a specialist machine that is directing the right amount of h
Electronics Forum | Fri Feb 09 08:07:41 EST 2007 | jax
Has the board been looked at under X-Ray? Have you built more than 1 of the boards in question? Do any of the other boards have the same problem? Have you made any changes to the profile between boards? One side of the BGA collapsing during reflow w
Electronics Forum | Wed Feb 14 12:09:34 EST 2007 | rob_thomas
This was a rather intersting little project to work on due to the fact that I had such a variety of components placed in SMT ( your regular 0402 passives, ,BGA's Qfp's ,TH and SMT connectors ,plus the pesky micro BGA) I ended up with a 5/3 mil electr
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
