Electronics Forum | Fri Jul 18 07:14:10 EDT 2003 | davef
BGA - Ball grid array QFP - Quad flat pack As a bonus, look here to learn more SMT terms and definitions http://www.smtnet.com/library/index.cfm?fuseaction=content_terms1 There are other listings of definitions and terms in the SMTnet Library. Lo
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Thu Aug 21 18:36:32 EDT 2003 | paulm
Hi Dave and Justin, Thanks for the advice. Dave you mentioned you "smush" your bga's. What type of machine are you placing then with it? Is the additional pressure to smush them machine or manually applied? Also, the 0.004" variance we are being
Electronics Forum | Tue Oct 28 12:41:42 EST 2003 | Stephen
I just reread your message. The wave soldering is on the other side? I.E. The Through hole parts are on the same side as the BGA. This would be the only way to do it. But reading the message again it could be interepted as the through hole parts
Electronics Forum | Wed Oct 29 17:30:17 EST 2003 | Gabriele
I am sorry, my understanding ( English is not my language)was to have BGA on SMT side, I mean destination solder of wave. But after your clarifiation, now I am in front to a DFX more that a Design for Manufacturing. In this case every think can be do
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Wed Nov 05 17:36:12 EST 2003 | Stephen
Make sure that the side of the square is the diameter of the pad, That is that the circle is inside the square not that the square is inside the circle. normally the aperatures are smaller than the pad to get gasketing. In this case the idea is to
Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
