Electronics Forum | Mon Apr 24 04:21:10 EDT 2006 | vpha
I have seen a Spark 400 at Apex Show. It appears to be a good Machine to do rework on BGA and others. I have used a SRT Summit 1100 Machine to do most BGA Reworks and want to have a Machine which can do rework better. Does anyone has any knowledge
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Thu Jun 01 21:14:21 EDT 2006 | roadhound
Hello, We repair mobile (cellular) phones, and most are now having their u-BGA IC's underfilled. Can anyone suggest methods for removal of the IC's ? The manufacturers are very vague when it comes to this process, but are starting to get tired of u
Electronics Forum | Thu Jun 22 04:25:26 EDT 2006 | emeto
Grant, The best rule is- "If it works don't touch it". What I mean is check your component datasheet. Max allowed temperature should be there. You know the profile of your reflow oven and the temperature reached during reflow. So if there is no conf
Electronics Forum | Sun Jun 25 23:17:30 EDT 2006 | Bolos
anyone who can comment and win for me..I prefer a BGA but my designer needs to add 3 dollars for the boards ..how to beat this 3 dollars from manufacturing pooint of view?..with a 15K volume of boards..therefore i need to beat 45K$ ...hell[p[p[[[...
Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Thu Jun 29 05:48:30 EDT 2006 | Loco
The first 3 points are process problems in your own plant. These should be solved anyway. 4th point isnt allways valid. 2 reasons pro qfp: -inspection and repair, do you have a good Xray system? Do you have a good BGA repair process?
Electronics Forum | Mon Jun 26 08:54:35 EDT 2006 | dougs
We have a new product in where a 0.7mm pitch uBGA is to be placed on a 2 layer flexi board. Also a 20thou pitch connector. Has anyone done anything like this before, what should i look out for. Not done much flexi work before so any tips will be g
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Fri Jul 14 14:46:59 EDT 2006 | Gman
Hello Folks, Has anyone come across this fascinating but undesirable surface appearance of BGA balls. I am not sure what it is called but I came across the term Black Island. To me it looks more like a disco ball. Lets just say the solder ball looks
