Electronics Forum | Wed Sep 08 06:22:51 EDT 2004 | Tore
Hi all, There seems to be a problem with the major component vendors/manufacturer everywhere; to supply lead free dummy/daisy chain components, in particular BGA-devices, within a reasonable time (not a big fan of 8-12 weeks). If they got them at all
Electronics Forum | Wed Sep 08 22:13:07 EDT 2004 | Frank
Our Juki KE-2020 can place up to 74mm X 74mm ICs and BGA. I am have placed this zif socket before on the KE-2020 that you are speaking of. I don't think the KE-2020s are being made any longer. I know the new KE-2060 machines (that replaced the KE-
Electronics Forum | Wed Sep 15 17:31:40 EDT 2004 | GS
Once you verified for correct profile ( consider CTE mismatch) make sure before you remove PBA from fixture, the temperature is almost at room temperature. If by removing PBA from fixture,and the PBA gets a little bent (warped) just in the area where
Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN
What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop
Electronics Forum | Fri Sep 17 07:44:41 EDT 2004 | Simon Uk
Yes, i have used and experienced problems with step stencils, but these were mainly to do with the communication of the requirements for the suppier. Best plan is to talk to your stencil supplier and get them to make the suggestions on what works bes
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Tue Mar 15 09:32:49 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Wed Jan 12 10:15:43 EST 2005 | davef
We conformal coat our boards and get pretty good coverage along the edges of BGA. If you need coverage along the edges and are not getting it, your supplier may be able to recommend a different material or application method. Most often, underfill
Electronics Forum | Thu Jan 27 11:45:04 EST 2005 | Mark
Based on the components mentioned, it sounds like you need a soldering station rather than a bga rework station. The equipment mentioned would allow you to rework fine pitch QFPs and BGAs. Reworking an sot-23 using one of those systems is inefficie
Electronics Forum | Mon Jan 31 07:36:54 EST 2005 | Nifhail
Hi all, In general, I am looking at restructuring of our rework processes in our factory. Despite all the effort put into design, process, material etc, there will always be some assemblies that must be repaired. Over the years, alot of hi-technolog
