Electronics Forum: bga's (Page 286 of 546)

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 07:38:48 EDT 2004 | Paddy

Hello, I am wondering if anybody has process experiance of designs which use the above. I understand that the filled via is an excellent thermal cnductor, which is great from a design point of view, but how do these solder through the reflow ovens

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 12:44:54 EST 2005 | ppwlee

Dave, Do you know if such thermal transfer study with CB-100 (or equivalent) is available for review? My customer is pursuing this option and I am curious on how much improvement I would see by specifying a conductive via fill on the board. Rgds, P

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 22:25:03 EST 2005 | davef

The authors of this article might get you started http://www.protoengineering.com/documents/viaplug.pdf Other information is: * http://www.dupont.com/pcm/techinfo/general/general9.html *

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 10:23:48 EDT 2004 | mrmaint

Matt, are there any discoloration of the pads on the raw boards. i have seen what we refer to as gray pads. Ran into this in the past and it turned out to be a problem at the board house with one of their dipping tanks. The proper levels for the proc

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 10:38:42 EDT 2004 | mattkehoe

Thats what I was thinking especially because the pads are not round, they have jagged edges which to me indicates some kind of development issue. mk

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:23 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:28 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks pbatten http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D

Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,

1mm BGA Underfill

Electronics Forum | Fri Oct 29 09:06:52 EDT 2004 | Rob

Hi Paddy, There's been a lot of low cost second user underfill equipment around recently, I've seen stuff go for as low as �20K - but make sure a dispense head is included. Good luck, Rob.

BGA Soldering

Electronics Forum | Mon Nov 01 15:35:25 EST 2004 | Ken

Agreed. You will find different part manufacturers have different coplanarity specs. In fact I have on supplier that calls out 7 mil max coplanarity. Then factor in board bow and twist and it becomes a real joy.


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