Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef
Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o
Electronics Forum | Tue Apr 03 17:00:46 EDT 2007 | Ryan Lee
Hi, I am using winslow reballing kit and instruction , and I have a hard time to get reball success. any one have good information to share. Please Thanks Ryan
Electronics Forum | Wed Apr 04 12:27:59 EDT 2007 | adrian_nishimoto
We reball hundreds of BGAs a week with the RB-2000 kit from Mini Micro Stencil, Inc. The reball stencils are made of stainless steel and can be used over and over again. We have reballed .5mm pitch parts with .012" balls up to 2400 ball BGAs.
Electronics Forum | Thu Apr 12 02:09:43 EDT 2007 | aram
Dear ALL, I Wish to know 1.which type of rework station is best compare to the IR or HOT air convection. 2.Which process plays best reliabilty on soldering after post soldering process. Pls, suggest ur best
Electronics Forum | Thu Apr 12 07:46:20 EDT 2007 | realchunks
Hi aram, Hot air is best. IR takes longer and is affected by the color of the part. Best post solder process that affects solder the most is handling.
Electronics Forum | Thu Apr 19 07:26:42 EDT 2007 | bartlozie
Hello, I was talking about the PACE TF 2700 rework station. price about 25.000 euro. kind regards
Electronics Forum | Tue May 01 09:51:51 EDT 2007 | slthomas
Where are you measuring your temperature at? Are you measuring pad/ball interface temp through a hole in the board, or a lead on a different part, or board surface, or.....?
Electronics Forum | Wed May 02 07:47:21 EDT 2007 | Bob R.
Don't dink with the profile until you have evidence that the profile has something to do with the problem. Step 1 is a cross-section. Where are the joints breaking? Do the joints show signs of proper wetting & intermetallic formation?
