Electronics Forum | Tue Jul 07 08:42:49 EDT 2009 | ewchong
kpm, you are probably right. under magnification those two pads show some exposed copper which means that they were contaminated or had insufficient solder paste before reflow.
Electronics Forum | Thu Jul 23 13:22:17 EDT 2009 | pnguyvu
Hi Sasha ! The company below custom make reballing kit for chip rework ( reballing ). Contact name: Steve Yen USA STENCILS INC. Website : http://www.usastencils.com Phone : 714-636-6211 Good luck!
Electronics Forum | Mon Jul 27 12:11:08 EDT 2009 | davef
While you're waiting for others to reply, search the fine SMTnet Archives for threads like: http://dev.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=40197
Electronics Forum | Fri Jul 31 21:51:09 EDT 2009 | quirmche
Cool I'll check that, thanks! How about maybe video training on rework/reflow?
Electronics Forum | Tue Aug 11 18:15:11 EDT 2009 | ysutariya
Have you looked into Sipad? They will pre-paste your BGA and other component areas with solderpaste that has an adhesive on it. You can then hand place your components and run through a reflow. Here's their site: http://www.sipad.com/
Electronics Forum | Wed Aug 12 08:41:34 EDT 2009 | dwl
Hand placing 200,000-400,000 components, including BGA's a month does NOT sound like fun....
Electronics Forum | Mon Aug 17 19:37:25 EDT 2009 | hegemon
And of course the obvious, you'll want to be running that second side on the rail, and not the belt. Yeah, yeah, too obvious, I know... but don't say no one said so! 'Hege
Electronics Forum | Fri Aug 14 11:22:20 EDT 2009 | davef
It's some time difficult to control process when using a heat gun. What is the intent of using the heat gun after test?
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Thu Aug 27 16:03:20 EDT 2009 | jim_n_hky
We recently had a very similar issue with BGA breaking off at the pad. We sent samples to a lab for SEM / EDX and they found that there was no intermatalic with the nickel, or very little do to high phosphorus. I recommend you get a board to a lab AS
