Electronics Forum | Wed May 05 09:59:44 EDT 1999 | Erick Russell
Several of our customers use our Summit series equipment for this purpose. Our rework stations are used in proto labs to prove manufacturability. Consider it a low volume, semiautomatic pick and place and selective soldering reflow oven. Some low
Electronics Forum | Thu Apr 29 17:33:30 EDT 1999 | Steve Gregory
Just curious, Are any of ya'll coming out here to the Chip scale and BGA National Symposium out here in Santa Clara, Cal-i-for-ni-yay next week? I'm a-goin'...gonna learn more about them little buggers...I just know enough now to be extremely dange
Electronics Forum | Thu Apr 29 17:40:40 EDT 1999 | JohnW
| Just curious, | | Are any of ya'll coming out here to the Chip scale and BGA National Symposium out here in Santa Clara, Cal-i-for-ni-yay next week? I'm a-goin'...gonna learn more about them little buggers...I just know enough now to be extremely
Electronics Forum | Wed Apr 28 04:26:24 EDT 1999 | Nigel Burtt
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Mar 24 09:22:16 EST 1999 | justin medernach
| We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any h
Electronics Forum | Sun Mar 07 17:01:45 EST 1999 | Steve Gregory
| And on it goes. Again, I can't thank you enough for your time. I will call you soon as others probably find this rhetoric a bit much. | | Earl Moon | Earl and Dean, No,no,no...please continue here. I've been gratefully reading everything y
Electronics Forum | Wed Feb 24 13:05:04 EST 1999 | Mike Larsen
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon
| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K
Electronics Forum | Wed Jan 06 10:51:33 EST 1999 | Scott McKee
| I would like comments from users about X-rays manufactured by Lixi Inc and Gleenbrook Technologies. Quality of product, servicing, ease of operation etc. | | We are currently looking into justification for such a product (table top) our next step
