Electronics Forum | Wed Sep 22 10:26:35 EDT 2004 | sumxp
Beside being reliable,flexible,the after sales maintenance support and spare parts availability in shortest leadtime is equally important. I choose Panasert/Panasonic because of above advantages.You can try MSF which can mount all packages(0201 to bg
Electronics Forum | Wed Oct 13 05:46:27 EDT 2004 | apetkov
Hi Do you know about some kind of database (library) with physical specifications of the most widely distributed SMD Components. Something like BGA, QFP, SOP, etc. and for each corpus width, length, pins, etc. JEDEC has something similar, but t
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Tue Nov 02 08:01:13 EST 2004 | mattkehoe
Isn't that a good reason to use more paste? With just the paste from the balls, do you really get as good a solder joint as with a standard amount of solder paste added? What about voids? Do they go away by not using paste? I am talking about initial
Electronics Forum | Mon Nov 08 15:10:52 EST 2004 | russ
We usually get some mask material from our board house. It cures with heat so it works really well in our applications. Be wary of the "overcoat pens" they don't seem to hold up under heat and thre solder will flow right underneath it during BGA a
Electronics Forum | Thu Nov 11 11:48:57 EST 2004 | rlackey
Adding flux prior to reflow was not an uncommon process on certain packages - a couple of our Universal GSM'S have flux heads for this reason (Not that we've ever used it on anything). What is the component they are suggesting using additional flu
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Wed Nov 24 19:32:06 EST 2004 | Dreamsniper
Hi, Has anyone done this? X-ray a populated PCB and found voids on chips and some IC solder joints? Is this kind of screening acceptable? I got a PCB with this problem and not ruling out paste, profile and contamination issues. Please Help as it see
Electronics Forum | Fri Dec 03 12:12:33 EST 2004 | mruzicka
Dreamsniper, We would need much more details about your process to help you to determine the source of voids. Type of paste, how long you leave your paste on stencil, your relative humidity, reflow profile, type of oven, oven environment (N2?) and so
Electronics Forum | Fri Dec 03 09:21:00 EST 2004 | Barb
We are implementing an AOL inspection system into our surface mount process. I would like to hear from anyone with an opinion on the different types of AOL and why they feel this is better than another one. Any information will be greatly appreciate
