Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Tue Feb 22 14:31:20 EST 2000 | JAX
If you are not placing any parts that need special attention ( BGA, CCGA, etc... ) on topside then it should be fairly easy to create a profile that will work for you. If you are wanting to use the profile you currently have for topside I am not sur
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych
Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Thu Sep 07 12:52:30 EDT 2000 | Doug
Which fuji machines do you have? The new manuals are pretty easy to follow, if you have them. SMD3 machines have the SMD3 Manual 7.1E and the BGA/Connector manuals available. Contact fuji training for more details. Otherwise, if you have certain ques
Electronics Forum | Thu Aug 24 15:12:29 EDT 2000 | Earl Moon
I don't entertain the forum like JAXSUN. I never have played games but for some humorous insights. I, when participating, never complained until management provided only more incentive to advertisers than forum members. That said, the following is a
