Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Fri Feb 13 09:17:11 EST 2004 | Kris
we are worried about the coating not being able to cover underneath the BGA. If the coat is excessive then it would cause CTE issues. Also if anybody has data on 85/85, 1000 hrs after conformal coating of BGA, would appreciate if you guys can share
Electronics Forum | Tue Mar 23 20:55:00 EST 2004 | Dreamsniper
First Time to solder BGA's using Water Soluble. We are currently using an Aquaeous Cleaner to clean our PCB's but I find it not enough to clean the flux from under our BGA's. Has anyone had this experience before that he may like to share how he mana
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Fri May 07 20:08:39 EDT 2004 | Ken
...um also, don't forget that ther are planarity issues associated with BGA devices AND bow-and-twist issues with PCB materials. An example I have one BGA device that has a ball planarity of 7 mils!!! Ant that's the OEM specification! THis will re
Electronics Forum | Wed May 19 04:27:18 EDT 2004 | johnwnz
Also look at IPC 7095 which is all abotu BGA processes including rework. the profile will be 100% based on your board - how many layers, how many are ground & signal, how many of those are the BGA connected to directly or indirectly, the component we
Electronics Forum | Wed Aug 04 16:46:40 EDT 2004 | davef
We assume this is different discussion that the discussion about "crystallized flux under BGA". Correct? Milky residue with water washing makes us think "noclean flux res that just got washed". We know what you said, but we can't help ourselves.
Electronics Forum | Mon Aug 09 17:02:32 EDT 2004 | arminski
Hi Shean, Thanks for the analysis. "Your product looks like it may have non-solder-mask-defined pads." Yes. It is a NSMD PCB. "Does there appear to be any residues on the bare boards, and/or, BGA components prior to applying the solder paste?"
