Electronics Forum | Fri Nov 21 09:27:40 EST 2008 | mmjm_1099
All, I have a question in regards to a simple way to verify if a BGA is PBF or PB? I have mixed BGAs in a bag and I was trying to figure a simplified way to verify which is which? Can you hit one with the other type solder and forms differently? Any
Electronics Forum | Tue Feb 03 10:10:27 EST 2009 | milroy
Hi, There is one thing missing still, you must put a TC from the bottom side of the BGA by making a hold on the test board at the TC can measure the temperature at exactly the middle of the BGA. You should be able to the dual time and peak temperatu
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Jul 22 08:10:24 EDT 2009 | olsa
Hello, this is my first question. More than 10 years my job was mobile phones repair, and for BGA repairing proces I used special template stencil, soldering paste and flux. Right now my job is notebook repair, and I'm interested about reballing of
Electronics Forum | Sun Sep 27 17:31:12 EDT 2009 | bandjwet
There are a couple of companies that make BGA > reballing kits. Try: Winslow Automation _a > class=roll > href="http://www.winslowautomation.com" > target="_blank"_http://www.winslowautomation.com_ > /a_ Another alternative BGA reballing kit
Electronics Forum | Thu Aug 13 03:41:30 EDT 2009 | robhs
At risk of raising a topic that has already been discussed at length, if that is the case then please point me in the right direction. We have a Lead-Free assembly that has BGA devices on both sides of the board. Any recommendations as to how we mig
Electronics Forum | Thu Feb 25 14:06:56 EST 2010 | CL
Good Afternoon Duane, Surface tension should be adequate to hold the smaller BGA's during second side reflow. You will need to ensure that nothing comes in contact with the parts during reflow. I have added a chipbonder adheasive at the edge of some
Electronics Forum | Wed Sep 01 11:51:01 EDT 2010 | horvath83
It's a very small series. There's already a decision to redesign the board to get rid of QUAD BGA transformers. We'll replace them with 2x transformers in other packages. We'll also try to order lead-free smaller BGA's on the other side to unify th
Electronics Forum | Sat Sep 18 06:23:39 EDT 2010 | bandu_shende
We are d2h pcb manufactures. We are having using ST BGA Ics un our pcbs. Can u please confirm how many will be the standard BGA rejection including parts,process etc.For example there must be 1 defect in thousand of two defects in thousand.What is th
