Electronics Forum | Thu Apr 23 22:01:07 EDT 2009 | davef
That you have one BGA of 30 BGA that has voids, makes us wonder what's the deal with that one BGA. Especially given that this is the initial run of a product with BGA at your plant, it really makes us want to understand just what is driving the voidi
Electronics Forum | Wed Apr 14 17:00:40 EDT 1999 | David
Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated!
Electronics Forum | Tue Feb 25 19:52:35 EST 2003 | vicentedelgado
Hi, We are experimenting with BGA recovery and we would like to know When is BGA Reballing not recommended?
Electronics Forum | Fri Jul 21 13:37:35 EDT 2006 | Chunks
Stencil clog on BGA apps. BGA not reflowing all the way - check profile.
Electronics Forum | Thu Aug 24 10:25:49 EDT 2006 | wrongway
we use a stencil and aply paste to the BGA have used sticky flux but prefer pasting the BGA
Electronics Forum | Tue Nov 18 14:33:45 EST 2008 | stepheniii
Do you mean BGA reballing? If so, then not with a hot air gun.
Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen
Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG
Electronics Forum | Tue Feb 18 16:31:43 EST 2003 | arturoflores
Haran: Have you made improvements regarding your BGA shorts? We are facing the same problem and we think it is partly because the non coplanarity of the seating plane of the BGA which causes BGA balls to squeeze on one side of the BGA. Also, we ha
Electronics Forum | Thu May 15 07:37:49 EDT 2003 | pteerink
Have seen similar circumstances a couple times. Possible causes: 1) PCB defect - remove the BGA and inspect/test the PCB for shorts. ( trace short, layer short etc ) 2) PCB defect that only shows up when the BGA is populated - a short somewhere o
Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
