Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Fri Aug 20 12:41:20 EDT 1999 | stefano bolleri
| | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | This is what I did. | | | | Created a removal pr
Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony
| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,
Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton
Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
Electronics Forum | Tue Oct 17 18:10:05 EDT 2000 | Philip A. Reyes
Yes, you need to conduct X-ray inspection for BGA-SMT assembly, but it doesn't mean 100%. If your process is well capable and robust you can do sampling. There is an available X-ray machine that right now Iam assessing, cause we are going to buy one.
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Tue Sep 05 07:38:36 EDT 2000 | JAX
Daniel, I think JOHN and Ramot have some good ideas but I guess I am a little confused. How have you placed BGA's or QFP's in the past. If you are just starting to place them and believe you will continue to in the future, you need to start looki
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