Electronics Forum | Tue Mar 23 12:19:45 EST 1999 | gcollier
We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any hel
Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Thu Jul 15 12:07:36 EDT 1999 | Mark
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discu
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Mon Jan 11 09:00:17 EST 1999 | Kelvin Chow
Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? Kelvin
Electronics Forum | Fri Dec 18 00:49:43 EST 1998 | Mr Mariscal
I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it does
Electronics Forum | Fri Dec 18 10:18:55 EST 1998 | Dave F
| I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it doe
Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Mon Nov 09 07:57:58 EST 1998 | Mark Quealy
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. | Winslow Automation in Cal. sells re-balling services as well as a line of preforms and fixtures to do it yourself. We've been re-ball
Electronics Forum | Thu Sep 10 17:25:40 EDT 1998 | Dave F
| Hi, | I'm having trouble getting good profiles for a couple of BGA's we're placing in small quantities and was hoping someone with SRT Summit 1000 experience might be willing to share some information regarding profiles, etc. | Thanks. | Rick Thomp
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