Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Tue May 20 06:00:33 EDT 2008 | roc2x
Im qualifying a new PCB. I run 2 diff supplier. Supplier A has Zero failure. Supplier B has 4 failure all having Lifted PAD on Bga same location and same location pads that lifted. How can I prove that the PCB have problem? Input : Both run in same o
Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics
Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in
Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas
We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss
Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker
These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m
Electronics Forum | Tue Aug 26 09:33:04 EDT 2008 | wavemasterlarry
If this board is waved soldered than you may want to look at the wave causing the BGA to reflow a 2nd time when it goes over the wave. The board bows down and the the joint liquidfies and then hardens before the board fully goes back to flat which c
Electronics Forum | Tue Sep 02 12:49:07 EDT 2008 | markhoch
Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Ref
Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas
Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We
Electronics Forum | Thu Dec 04 07:22:54 EST 2008 | wavemasterlarry
Looks like my message got cut out. What I meant to say is I like balloons but you can't use em at work next to pcbs cause of the static. You gott abe sencable about stuff like that. Always where your ground straps and you can were what ya want.
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
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