Electronics Forum | Mon Jan 31 07:36:54 EST 2005 | Nifhail
Hi all, In general, I am looking at restructuring of our rework processes in our factory. Despite all the effort put into design, process, material etc, there will always be some assemblies that must be repaired. Over the years, alot of hi-technolog
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Thu Mar 10 15:10:07 EST 2005 | bandjwet
In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum me
Electronics Forum | Fri Apr 08 07:55:14 EDT 2005 | CN
Sounds like it would by tough to justify, thought of oursourcing? if the volume is really that low I bet it would be cheaper to find an outside source to build them for you. As far as hand placment accuracy If you are hand placing BGA's or even worse
Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Wed Mar 08 15:37:28 EST 2006 | Mike H
I think Peter gave up since I have not seen anything from him since original question on comparing Metcal to Airvac. I personally prefer SRT to either of these two. SRT proven that the software and its' semi or full auto operation is superior to any
Electronics Forum | Tue Aug 15 00:46:21 EDT 2006 | ahmad
Guys I do not know what you guys are trying to prove. If you have a BGA job to be done JUST forget about using any equipment that is using hot air since you will get into a lot of trouble. It will bend the PCB and need nozzole for each IC find an ER
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
