Electronics Forum: bga (Page 331 of 546)

Melted BGA part

Electronics Forum | Thu Sep 15 16:07:19 EDT 2016 | davef

In electronic manufacture, it's never good when "oozing" is part of the conversation. "Bridging" that's bad too. "Melting" sometimes good, sometimes bad. Got pix? How about some nice color pictures?

Melted BGA part

Electronics Forum | Tue Sep 20 13:11:48 EDT 2016 | ladmo1

I do have a couple pictures, but they aren't very clear and I am not sure how to post them on this site yet.

Poor Wetting On The BGA.

Electronics Forum | Fri Oct 21 12:22:56 EDT 2016 | horchak

Looking at your picture I'm not sure you have a wetting problem. Who determined it's not wetted? Are you having functional failures? Is this an isolated incident? What was your TAL? Is the pad on the suspect ball possibly smaller than the others, or

Poor Wetting On The BGA.

Electronics Forum | Fri Sep 15 07:55:32 EDT 2017 | kubabel

Dear Thanesh, did You alrady solved issue? We are facing same problems... Unfortunately reject rate is too small to find something wrong directly in production...

Poor Wetting On The BGA.

Electronics Forum | Wed Sep 20 12:12:51 EDT 2017 | edhare

SEM Lab, Inc. supports this type of analysis. Please see semlab.com & semlab.com/blog for examples. Thanks!

Samsung SM421

Electronics Forum | Wed Oct 26 09:50:27 EDT 2016 | schmidtv62

I'm looking for any information on the Samsung SM421 regarding BGA placement. We currently have a Universal GSM (circa 2004) GI-14 and we are approaching software limitations on multi-pitch BGAs. Any additional information about the SM421 capabilit

Reflow of CMOS camera chips (BGA)

Electronics Forum | Wed Jan 18 11:26:22 EST 2017 | dilogic

Is there something special to care about while reflowing CMOS camera chips? They are pretty reflective on the surface, so I guess IR-type oven is not the best choice...

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed May 31 07:55:55 EDT 2017 | buckcho

In IPC it is said that the void % should be established between you and the customer. There is no number. There is only requirement for balls on BGA. I have a customer that agreed to 40% on D-packs which is okay for both us and them.

Mydata software

Electronics Forum | Wed Apr 05 12:27:52 EDT 2017 | emeto

the package should have nozzle(midas) and camera pre-selected(hydra camera will not work(try standard or high resolution). Odd shape recognition type will not use auto teach option(try chip, leaded, BGA.... )

How are you reworking high mass LED pcb's?

Electronics Forum | Fri Jul 07 16:52:20 EDT 2017 | tombstonesmt

We had very little success reworking these type of boards. We used a BGA repair station and still was a major hassle. Are these shifted LED's or defective?


bga searches for Companies, Equipment, Machines, Suppliers & Information

Beau Tech
Beau Tech

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Manufacturer

98 Elm St.
Portland, ME USA

Phone: 1-207-775-6139